ZHUHAI TOTKING ELEC.TECH CO.,LTD
ADDRESS: NO.6 GangShan  Road,Gongbei, ZhuHaiCity Guangdong Province,China
TEL:0756-8888066
FAX:0756-8888756
E-MAIL:INFO@TOTKING.COM
POSTCODE:519020
 
 
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 QB-AL series Aluminum base copper clad laminate
   
 Features: Applications:
  ● Excellent thermal conductivity  ● LED lighting
  ● Excellent insulating ability  ● Thick film hybrid
  ● Excellent dimensional    integrated circuits
    stability  ● Power supply
  ● Excellent Machinability  ● Solid Relay
  ● Excellent electromagnetic  
    shielding  
  ● High quality but low price  
Performance:
Item
Test condition
Units
Index
T-101
T-111
T-112
Thermal Conductibility
A
W/m·k
1.5~2.0
1.8~3.0
2.5~5.0
Peel Strength
A

After thermal stress
N/mm
1.5

1.5
1.5

1.5
1.3

1.3
Thermal stress

288℃
No-delimitation, No-blistering
S
90S
60S
60S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
30
30
Flammability
UL94
V-0
V-0
V-0
Warping
A
%
0.15
0.15
0.15
Moisture absorption
D-24/23
%
0.05
0.05
0.05
CTI
IEC60112
V
200
175
175
 
Item
Test condition
Units
Index
T-113
T-114
Thermal Conductibility
A
W/m·k
1.5~2.0
1.5~2.0
Peel Strength
A
After thermal stress
N/mm
1.3

1.3
1.3

1.3
Thermal stress

288℃
No-delimitation, No-blistering
S
600S
600S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
30
Flammability
UL94
V-0
V-0
Warping
A
%
0.15
0.15
Water Absorption
D-24/23
%
0.05
0.05
CTI
IEC60112
V
 
Special base copper clad laminate——Thick copper clad laminate(4 oz ~ 10 oz)
   
Features: Applications:
  ● Excellent thermal conductivity  ● high-current, high-power
  ● Excellent insulating ability    circuits in Power
  ● Excellent dimensional    electronics
    stability  ● high-current, high-power
  ● Excellent Machinability    circuits in automotive
  ● Excellent electromagnetic    electronics
    shielding  
 
Performances:
 
Item
Test condition
Units
T-200 Index
Thermal Conductibility
A
W/m·k
1.5~3.0
Peel Strength
A

After thermal stress
N/mm
≥3

≥3
Thermal stress

288℃
No- delimitation No-blistering
S
60S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
Flammability
UL94
V-0
Warping
A
%
0.2
Water Absorption
D-24/23
%
0.1
CTI
IEC60112
V
175
 
Special base copper clad laminate——Ferrum base copper clad laminate T-300
   
Features: Applications:
  ● Excellent dimensional stability  ● No brushes direct
  ● Excellent thermal conductivity    current motor
  ● Excellent insulating ability  ● laser printer motor
  ● Excellent Machinability  ● Intelligent Driver
  ● Excellent Magnetoconductivity  
  ● High performance but low price  
 
Performance:
Item
Test condition
Units
T-300 Index
Thermal Conductibility
A
W/m·k
1.5~3.0
Peel Strength
A

After thermal stress
N/mm
1.5

1.5
Thermal stress

288℃
No- delimitation,
No-blistering
S
30S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
Flammability
UL94
V-0
Warping
A
%
0.2
Water Absorption
D-24/23
%
0.1
CTI
IEC60112
V
175
 
Special base copper clad laminate——Stainless steel base copper clad laminate T-400
   
Features: Applications:
  ● Excellent chemical resistance   ● Lighting circuits in
  ● Excellent thermal conductivity     benthal
  ● Excellent insulating ability    
  ● Excellent dimensional stability  
  ● Excellent Weatherability  
    
Performance:
Item
Test condition
Units
T-400 Index
Thermal Conductibility
A
W/m·k
1.0~2.5
Peel Strength
A

After thermal stress
N/mm
1.5

1.5

Thermal stress

288℃
No- delimitation,
No-blistering
S
30S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
Flammability
UL94
V-0
Warping
A
%
0.2
Water absorption
D-24/23
%
0.1
CTI
IEC60112
V
175
 
Special base copper clad laminate——Copper base copper clad laminate T-500
     
Features: Applications:
  ● Excellent thermal conductivity   ● LED lighting circuits
  ● Excellent insulating ability   ● Thick film hybrid
  ● Excellent dimensional     integrated circuits
    stability   ● Power supply circuits
  ● Excellent Machinability   ● Solid Relay
  ● Excellent electromagnetic  
    shielding    
  ● High quality but low price    
 
Performance:
Item
Test condition
Units
T-500 index
Thermal Conductibility
A
W/m·k
1.5~3.0
Peel Strength
A

After thermal stress
N/mm
≥3

≥3
Thermal stress

288℃
No- delimitation,
No-blistering
S
40S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
Flammability
UL94
V-0
Warping
A
%
0.2
Water absorption
D-24/23
%
0.1
CTI
IEC60112
V
175
 
pecial base copper clad laminate——Resistance foil clad laminate T-600
   
Features: Applications:
  ● High resistance precision    ● rtificial satellite, Radar, Navigation,
  ● Low temperature coefficient      Computer, Automotive motor system,
  ● Excellent loading stability      Photography system,High definition
  ● Low noise      television, etc.
  ● Low electromotive force  
    
 
Performance:
Item
Test condition
Units
T-600 Index
Resistivity
A
μΩ·m
0.48
Peel Strength
A

After thermal stress
N/mm
0.7

0.7
Thermal stress

288℃
No-delimitation,
No-blistering
S
10S
Surface Resistance
C-96/35/90

E-24/125
Volume Resistivity
C-96/35/90

E-24/125
MΩ·cm
Electrical strengthen
A
KV/mm
30
Flammability
UL94
V-0
Warping
A
%
1.0
Water absorption
D-24/23
%
0.5
 
 
 
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