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Aluminum
Base Copper Clad Laminate (ABCCL) VS.
FR-4 |
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| 1、Different
Structure |
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| ABCCL
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Single-sided
FR-4
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Double-sided
FR-4 |
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| 2、Different
Characteristic |
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| Primary
Difference (ABCCL VS. FR-4): |
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| Note：◎：very good；○：good；△：general；×：Bad |
| Thermal
relief |
| Thermal
relief comparison (ABCCL VS. FR-4) |
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| Substrate
type |
Thickness（mm） |
Saturated Thermal
Resistance（℃/W） |
ABCCL |
1.0 |
1.10 |
FR-4 |
1.2 |
7.83 |
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As
different thermal conductivities, the work temperatures
of ABCCL and FR-4 that assembled transistors
ascend differently. |
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| Substrate
type |
Ascended
temperature（radiation 5W）℃ |
Saturated
Thermal Resistance （℃/W） |
ABCCL |
1.0 |
1.10 |
FR-4 |
1.2 |
7.83 |
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Comparison between circuits
(copper) on different substrates and fusing
current is shown in
Figure 1.As high thermal conductivity, the fusing
current improves obviously. |
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Thermal
relief of ABCCL is associated with the thickness
of dielectric layer and thermal conductivity.
Thinner the dielectric layer, higher the thermal
conductivity. (But lower the Dielectric Breakdown
Voltage) |
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| Machinability |
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ABCCL with higher mechanical
strength and toughness than FR-4, so large-scale
PCB can be manufactured and heavier components
also can be assembled on the ABCCL. |
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| Electromagnetic
shielding |
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Assuring the performance
of circuit, some components of electrical products
need avoiding electromagnetic interference.
And ABCCL has excellent electromagnetic shielding.。 |
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| Coefficient
of Thermal Expansion |
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As general FR-4 has the problem
of thermal expansion(especially in thickness
direction )that effects the quality of PTH，circuitry.
The reason is the difference of coefficient
between FR-4 and ABCCL: coefficient of copper
is 17×106 cm/cm·℃,in contrast, coefficient of
FR-4 substrate is 110×106cm/cm·℃,and the thermal
expansion may cause the interruption between
PTH and circuitry, effect the reliability of
products. Nevertheless, coefficient of ABCCL
is 50×106cm/cm·℃ that is lower than general
FR-4, and more closed to copper foil, is helpful
to ensure the quality and reliability of PCB. |
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| 3、Different
application |
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FR-4 is applied in general
circuit design and electrical products. In contrast,
ABCCL is the same with
special demanded circuit. Such as thick film
hybrid integrated circuits, thermal shunt in
electrical source and
electrocircuit, large-scale substrates that
Ceramic Substrates incapable of working, etc.
The typical examples
are shown below: |
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Computer |
Power supply fixture, Floppy
drive, Main board |
Auto,
Motorcycle |
Voltage adjuster, Lighter, Safe and Automatic
Control System |
Power
supply |
DC/DC, AC/DC, DC/AC, Transformer |
Acoustics |
Output amplifier, Equilibrium amplifier,
Preamplifier |
Electron |
Solid relay, Transistor basement |
Others
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Radiator, Precision Motor, Apparatus,
Industry automatic equipment |
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